Patent
1988-06-03
1990-04-17
Davie, James W.
357 79, H01L 2310
Patent
active
049185136
ABSTRACT:
An IC chip socket for receiving an IC bare chip carrier includes a guide member for guiding the periphery of the IC chip carrier. The guide member supports a plurality of connector pins having one end projecting within the guide member and another end projecting without the guide member. The connector pins electrically connect the electrodes of the chip carrier to the electronic circuit substrate. The respective ends of the connector pins projecting within the guide member are brought into contact with the electrodes of the IC chip carrier. The ends of the connector pins which project without the guide member are connectable with the electrodes mounted on the surface of the electronic circuit substrate.
REFERENCES:
patent: 4144648 (1979-03-01), Grovender
patent: 4381131 (1983-04-01), Demnianiuk
patent: 4692790 (1987-09-01), Oyamada
Kurose Mitsukazu
Minowa Masahiro
Davie James W.
Kaplan Blum
Seiko Epson Corporation
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