Socket for an integrated circuit chip carrier and method for pac

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 79, H01L 2310

Patent

active

049185136

ABSTRACT:
An IC chip socket for receiving an IC bare chip carrier includes a guide member for guiding the periphery of the IC chip carrier. The guide member supports a plurality of connector pins having one end projecting within the guide member and another end projecting without the guide member. The connector pins electrically connect the electrodes of the chip carrier to the electronic circuit substrate. The respective ends of the connector pins projecting within the guide member are brought into contact with the electrodes of the IC chip carrier. The ends of the connector pins which project without the guide member are connectable with the electrodes mounted on the surface of the electronic circuit substrate.

REFERENCES:
patent: 4144648 (1979-03-01), Grovender
patent: 4381131 (1983-04-01), Demnianiuk
patent: 4692790 (1987-09-01), Oyamada

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Socket for an integrated circuit chip carrier and method for pac does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Socket for an integrated circuit chip carrier and method for pac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket for an integrated circuit chip carrier and method for pac will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1056501

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.