Compact CMOS device structure

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357 59, 357 236, 357 2311, 357 41, H01L 2702

Patent

active

049185101

ABSTRACT:
A compact CMOS structure and method for fabricating the structure are disclosed. In one embodiment of the invention the structure includes a P-type surface region in a silicon substrate surrounded by a field oxide which extends, at least in part, above the surface of the substrate. A polycrystalline silicon sidewall frame is formed at the sidewall of the field oxide and a gate insulator is formed over both the polycrystalline silicon frame and the silicon surface region. A common gate electrode is formed which traverses the frame and the surface region. P-type source and drain regions are formed in the polycrystalline silicon frame on opposite sides of the gate electrode and N-type source and drain regions are formed in the surface region on opposite sides of the gate electrode.

REFERENCES:
patent: 4370669 (1983-01-01), Donley
patent: 4404579 (1983-09-01), Leuschner
patent: 4651408 (1987-03-01), MacElwee
patent: 4654121 (1987-03-01), Miller et al.
patent: 4710897 (1987-12-01), Masuoka
patent: 4771323 (1988-09-01), Saski
patent: 4799097 (1989-01-01), Szluk et al.

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