Semiconductor heat removal apparatus with non-uniform conductanc

Details Semiconductor heat removal apparatus with non-uniform conductanc Semiconductor heat removal apparatus with non-uniform conductanc

1992-06-12

1993-09-21

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257712, 361690, 361717, H05K 720

Patent

active

052474267

ABSTRACT:
An apparatus for removing heat from a semiconductor is disclosed. The apparatus is a non-uniform thermal conductance structure which includes high thermal conductance regions and low thermal conductance regions. The apparatus is coupled to the semiconductor in such a manner that the high power density, and thus high temperature, regions on the semiconductor are aligned with the high thermal conductance regions of the apparatus, and low power density, and thus low temperature, regions on the semiconductor are aligned with the low thermal conductance regions of the apparatus. As a result, a desirable temperature profile may be established across the surface of the semiconductor.

REFERENCES:
patent: 4884630 (1989-12-01), Nelson
patent: 4966226 (1990-10-01), Hamburgen
patent: 4995451 (1991-02-01), Hamburgen
patent: 5083373 (1992-01-01), Hamburgen
Hamburgen, William; "Die Attach Structure and Method", Ser. No. 07/417,730; Filed Oct. 5, 1989.
Hamburgen, William; "Die Attach Structure and Method", Ser. No. 07/628,944; Filed Dec. 14, 1990.
Hamburgen, William; "Hollow Chip Package and Method of Manufacturing", Ser. No. 07/725,376; Filed Jun. 27, 1991.
Hamburgen, William; "Semiconductor Package and Method of Wraparound Metalization", Ser. No. 07/542,179, Filed Jun. 22, 1990.
Hamburgen, William et al.; "Fixture and Method for Attaching Components", Ser. No. 07/722,972; Filed Jun. 28, 1991.

Affiliated with

Also associated with

Rating

Semiconductor heat removal apparatus with non-uniform conductanc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor heat removal apparatus with non-uniform conductanc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor heat removal apparatus with non-uniform conductanc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1054785