Method of forming contacts on semiconductor members

Details Method of forming contacts on semiconductor members Method of forming contacts on semiconductor members

1986-09-11

1990-04-17

Hoch, Raymond

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

136250, 437 2, 437246, H01L 3104

Patent

active

049177524

ABSTRACT:
The disclosure relates to a method of forming adherent contacts to oxide coated semiconductor material wherein the oxide coating and a portion of the semiconductor material are mechanically removed, such as by abrading, to provide a roughened surface on the semiconductor material. The contact material is then applied over the mechanically roughened surface and bonded at elevated temperatures to provide the adherent contact.

REFERENCES:
patent: 2904613 (1959-09-01), Paradise
patent: 3038952 (1962-06-01), Ralph
patent: 3040416 (1962-06-01), Matlow et al.
patent: 3480818 (1969-11-01), Te Velde
patent: 3669760 (1972-06-01), Rein et al.
patent: 3847758 (1974-11-01), Te Velde
patent: 4407320 (1983-10-01), Levine
patent: 4451968 (1984-06-01), Jensen et al.
patent: 4514580 (1985-04-01), Bartlett

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