Electronic component device and its manufacturing method

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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257698, 437209, H01L 2302

Patent

active

055458491

ABSTRACT:
The invention is an electronic component device in the form of an envelope including a glass cover and a glass shell bonded together for hermetically sealing a surface acoustic filter inside the envelope. Electrical connections are provided from the filter's electrodes to the outside of the envelope by means of through holes in the cover. Each through hole has an electrode disposed around its periphery on the upper and bottom surfaces of the cover and a conductive layer disposed on the internal surface of the hole. A metal foil is formed on the bottom electrode sealing the hole and pressed downward and deformed against a filter electrode to complete a connection between the filter electrode, the metal foil, the conductor layer and the electrodes disposed around the periphery of the hole, and to hermetically seal the hole.

REFERENCES:
patent: 3387365 (1968-06-01), Stelmak
patent: 3887783 (1975-06-01), Comette
patent: 4639631 (1987-01-01), Chason et al.
patent: 4905075 (1990-02-01), Temple et al.
patent: 5065506 (1991-11-01), Kiribayashi
patent: 5098864 (1992-03-01), Mahulikar
patent: 5248901 (1993-09-01), Temple
patent: 5250870 (1993-10-01), Fenlon et al.
patent: 5261157 (1993-11-01), Chang
patent: 5288007 (1994-02-01), Interrante et al.
patent: 5376860 (1994-12-01), Sato
Nachrichten Technik Elektronik, "Mikrokontaktieren An Wandlerstrukturen Von Oberflachenwellenfiltern", H. Opitz et al., pp. 68-70 (1980).

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