Resin sealed semiconductor device

Details Resin sealed semiconductor device Resin sealed semiconductor device

1990-10-23

1991-12-10

Hille, Rolf

357 72, H01L 2348, H01L 2330, H01L 2350

Patent

active

050722808

ABSTRACT:
A resin sealed semiconductor device includes leads of a lead frame having no semiconductor component mounting portion and fixed to an upper surface of a semiconductor element through insulating adhesive. Metal wires connect the leads to bonding pads of the semiconductor element and these components are resin-sealed. An insulating film is provided on a part of the upper surface of the lead so that the metal wire can cross the lead without making electrical contact.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.

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