Shaped solder pad for surface mounting electronic devices and a

Details Shaped solder pad for surface mounting electronic devices and a Shaped solder pad for surface mounting electronic devices and a

1985-06-17

1987-02-24

Godici, Nicholas P.

Metal fusion bonding

Solder form

2281802, B23K 3514

Patent

active

046451145

ABSTRACT:
Solder pads for surface mounting of devices on a circuit board are given predetermined shapes. By shaping of a solder pad, or contact pad, a device will be held in, or moved to, a desired position on melting of the solder at the pad. Improved alignment and positioning is obtained. Broadly, a contact or solder pad comprises a rectangular portion and a segmental portion, the device end resting on the rectangular portion and the segmental portion being outside of the contact position.

REFERENCES:
patent: 3614832 (1971-10-01), Chance et al.

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