Resin compositions and a method of curing the same

Details Resin compositions and a method of curing the same Resin compositions and a method of curing the same

1989-09-05

1991-06-25

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525100, 5254445, 525446, 525440, 525479, 528 16, 528 17, 528 26, 528 27, 528 28, C08F28300

Patent

active

050267930

ABSTRACT:
A resinous composition containing (A) a high molecular weight hydroxy compound having 2 or more hydroxy groups per molecule and having a number average molecular weight of 3,000 to 200,000, (B) a high molecule weight epoxy compound having 2 or more epoxy groups per molecule and having a number average molecular weight of 120 to 200,000, (C) a silane compound having one or more silicon-containing functional groups per molecule and (D) a chelate of aluminum, titanium or zirconium with a ligand exhibiting ketoenol tautomerism, can be cured at temperatures not exceeding 100.degree. C. and forms a desirable coating when cured.

REFERENCES:
patent: 4657986 (1987-04-01), Isayama et al.
patent: 4889768 (1989-12-01), Yokoshima et al.
patent: 4923945 (1990-05-01), Isozaki et al.

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