Mold for encapsulating a component having a lead at an angle to

Static molds – Uniting preform with molding material – Split mold clamps and supports preform

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

249 97, 425129R, 425806, B29C 604

Patent

active

041555325

ABSTRACT:
A mold comprising a pair of mold sections which when closed form separate communicating chambers for receiving a component body and a portion of a non-axial lead extending from the component body at an angle to the axis of the body. Molten plastic introduced into the mold encapsulates the capacitor body while the plastic which surrounds the lead portion is readily detached from the lead portion.

REFERENCES:
patent: 3542328 (1970-11-01), Deitrick
patent: 3617876 (1971-11-01), Robinson
patent: 3685784 (1972-08-01), Spanjer
patent: 3768945 (1973-10-01), Waid
patent: 3838316 (1974-09-01), Brown et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mold for encapsulating a component having a lead at an angle to does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold for encapsulating a component having a lead at an angle to , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold for encapsulating a component having a lead at an angle to will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1036849

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.