Plastic packaged semiconductor device

Details Plastic packaged semiconductor device Plastic packaged semiconductor device

1988-12-14

1990-11-27

James, Andrew J.

Fishing, trapping, and vermin destroying

357 72, 357 74, 437209, H01L 2348

Patent

active

049740520

ABSTRACT:
A plastic packaged semiconductor device includes a semiconductor chip with electrodes formed on the surface thereof, a package body made of resin molded to the semiconductor chip, and an adhesion improving film formed on those portions of the surface of the semiconductor chip which surround the electrodes for enhancing the adhesion of the semiconductor chip to the package body.

REFERENCES:
patent: 3953877 (1976-04-01), Sigusch et al.
patent: 4001870 (1977-01-01), Saiki et al.
patent: 4005455 (1977-01-01), Watrous, Jr. et al.
patent: 4017886 (1977-04-01), Tomono et al.
patent: 4060828 (1977-11-01), Satonaka
patent: 4733289 (1988-03-01), Tsurumaru
patent: 4821148 (1989-04-01), Kobayashi et al.
patent: 4853761 (1989-08-01), Ikeda
patent: 4926238 (1990-05-01), Mukai et al.

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