Method of separating multi-layer printed circuit wiring boards

Details Method of separating multi-layer printed circuit wiring boards Method of separating multi-layer printed circuit wiring boards

1991-01-31

1991-12-10

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

294264, 294265, 156344, H05K 300

Patent

active

050706039

ABSTRACT:
A method of separating/splitting multi-layer printed circuit wiring boards by immersing the board and the blade of a surgical knife into liquid nitrogen to lower their temperatures to that of the liquid nitrogen thereby altering the holding properties of the adhesive material between the layers of the multi-layer board. Separating one layer at a time from the printed circuit wiring board until all layers of the multi-layer board have been removed.

REFERENCES:
patent: 4623255 (1986-11-01), Suszko
patent: 4766516 (1988-08-01), Ozdemir et al.
patent: 4956042 (1990-09-01), Hubert et al.
patent: 4963205 (1990-10-01), Hubert
patent: 4969247 (1990-11-01), Rossi

Affiliated with

Also associated with

Rating

Method of separating multi-layer printed circuit wiring boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of separating multi-layer printed circuit wiring boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of separating multi-layer printed circuit wiring boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1031674