Semiconductor cooling device

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

16510433, 165908, 361384, H05K 720

Patent

active

050219243

ABSTRACT:
A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling liquid injection ports are so arranged that the cooling liquid flows substantially in parallel with the back surfaces of the chips.

REFERENCES:
patent: 3298195 (1967-01-01), Raskhodoff
patent: 3524497 (1970-08-01), Chu
patent: 3843910 (1974-10-01), Ringuet
patent: 4158875 (1979-06-01), Tajima
patent: 4315300 (1982-02-01), Parmerlee
patent: 4399484 (1983-08-01), Mayer
patent: 4485429 (1984-11-01), Mittal
patent: 4838041 (1989-06-01), Bellows
patent: 4851965 (1989-07-01), Gabuzda
"Silicon Heat Sink . . . Temperatures", Ahearn, IBM Tech. Discl. Bul., vol. 21, No. 8, Jan. 79, pp. 3378-3380.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor cooling device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor cooling device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor cooling device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1031081

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.