Multilevel integrated circuit capacitor and method of fabricatio

Details Multilevel integrated circuit capacitor and method of fabricatio Multilevel integrated circuit capacitor and method of fabricatio

1990-03-30

1991-06-04

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 234, 357 51, 437 60, H01G 406, B01J 1700, H01L 2348

Patent

active

050219200

ABSTRACT:
A multilevel capacitor includes a selected number of interleaved conductive layers alternately of first and second conductivity types, each separated by interleaved dielectric layers, forming multilevel capacitor plates. The multilevel capacitor plates include at least first and second contact-edge areas, each including adjacent edges of each interleaved conductive/dielectric layer.
A first electrode of the first conductivity type contacts the first contact-edge area, and a second electrode of the second conductivity type contacts the second contact-edge area. That is, these electrodes contact the corresponding edges of the interleaved conductive/dielectric layers within respective contact-edge areas.
When appropriate bias voltages are applied to the first and second electrodes, each electrode is conductively coupled to the interleaved conductive layers of the same conductivity type, and junction isolated from the interleaved conductive layers of the other conductivity type, thereby permitting alternate layers to be changed to alternate potentials.

REFERENCES:
patent: 3864817 (1975-02-01), Lapham et al.
patent: 4685197 (1987-08-01), Tigelaar et al.
patent: 4890144 (1989-12-01), Teng et al.

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