Printed wiring board and method for preparing the same

Details Printed wiring board and method for preparing the same Printed wiring board and method for preparing the same

1996-01-30

1997-10-28

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428469, 4284722, 428701, 428699, 428698, 428702, 428901, 427304, B32B 300, B32B 900, B05D 304

Patent

active

056816480

ABSTRACT:
The present invention provides a novel printed wiring board which has an insulating substrate. The printed wiring board also has a metal compound layer formed on a surface of the insulating substrate, wherein the metal compound layer is made of a metal compound having a sufficient insulating property and showing a reduction to a metal. The metal compound layer has a surface formed thereon with a metal wiring pattern which is formed by selective reduction of the above metal compound of the metal compound layer. The printed wiring board also has a palladium-displacement plating layer formed on the metal wiring pattern. The printed wiring board also has an electroless plating layer.

REFERENCES:
patent: 3335050 (1967-08-01), Makowski et al.
patent: 4535029 (1985-08-01), Intrater et al.
patent: 4761303 (1988-08-01), Ruszczyk et al.
patent: 4772080 (1988-09-01), Tustison
patent: 5389446 (1995-02-01), Yamanishi et al.

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