Molded integrated circuit package incorporating heat sink

Details Molded integrated circuit package incorporating heat sink Molded integrated circuit package incorporating heat sink

1990-02-12

1991-11-12

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361387, 361405, 361421, 174 522, H05K 720

Patent

active

050652818

ABSTRACT:
A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between the IC chip and the exterior of the molded package for direct conduction of heat from the IC chip to the exterior of the package.

REFERENCES:
patent: 3686533 (1972-08-01), Garnier
patent: 3836825 (1974-09-01), Hall
patent: 3930114 (1975-12-01), Hodge
patent: 3984166 (1976-10-01), Hutchinson
patent: 4132856 (1979-01-01), Hutchinson
patent: 4524238 (1985-06-01), Butt
patent: 4855868 (1989-08-01), Harding
patent: 4868349 (1989-09-01), Chia
patent: 4885126 (1989-12-01), Polonio

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