Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1999-02-09
2000-09-12
Reichard, Dean A.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
3613081, 3613212, 29 2535, 29854, 29 2541, 29 2542, H01L 4122, H01G 4008, H01G 220
Patent
active
061186473
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to electronic components used as multilayer ceramic components and the like, and a method for producing the same.
BACKGROUND ART
As shown in FIGS. 4(a) and 4(b), conventional multilayer-ceramic-electronic-components are fabricated by alternating layers of ceramic layer 1 and inner electrode 2 so that multilayer body 3 is formed, which is then fired into the multilayer ceramic components.
The conventional multilayer-ceramic-electronic-components however include possibility of defective connections between the inner electrodes and outer electrodes due to the causes below: 2 after both are fired. 2a of inner electrode 2 is sometimes recessed from a plane flush with end face 1a of ceramic layer. after the ceramic layer 1 and inner electrode 2 are fired, defective connections between the outer electrode and inner electrode 2 can be expected due to the foregoing causes. As a result, desired electrical performance is not effected.
The following countermeasure has been taken to overcome this problem. End face 1a of ceramic layer 1 is ground until end face 2a of inner electrode 2 appears, then the outer electrode is applied to multilayer-sintered-body 3a. This method however increases a number of manufacturing processes, and therefore prolongs a manufacturing time. As a result, a manufacturing cost is boosted.
A number of layers increases at less thickness of inner electrode 2. Even the end face 1a is ground until the end face 2a of inner electrode 2 appears, the appearing area becomes smaller at a greater number of layers. Therefore, insufficient contacts between inner electrode 2 and the outer electrode can be expected. As a result, the desired electric performance is not effected and a number of layers to be increased is limited.
DISCLOSURE OF THE INVENTION
The present invention addresses these problems and aims to provide electronic components free from grinding process after the firing, and the inner electrode thereof being further thinned in size, and also to provide a manufacturing method of the same components.
An electronic component according to the present invention comprises the following elements; (a) inner electrodes embeded in the component, (b) conductive sections formed by collected vapor of conductive material different from the material of electrode, the conductive sections being provided selectively only on the appearing ends of the inner electrodes, and (c) an outer electrode provided on the component and coupled to the inner electrodes via the conductive sections. This structure allows the inner electrodes to form the conductive sections on the appearing end faces. The conductive section is made of the material collected on the appearing end of the inner electrode, the material is different from the inner electrode, and grows larger in step with progress of inner electrode's being sintered. As a result, the outer electrode disposed on the component can be coupled with the inner electrode with ease.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross section depicting a schematic diagram of a multilayer ceramic capacitor in accordance with a first exemplary embodiment of the present invention.
FIG. 2 is a cross sectional view of a schematic diagram of sintered multilayer ceramic capacitor in accordance with a first exemplary embodiment of the present invention.
FIG. 3 is a characteristic diagram illustrating how the weight reduction of platinum mesh depends on oxygen density.
FIG. 4(a) is a cross sectional view of a schematic diagram of a conventional multilayer-ceramic-capacitor before the firing. FIG. 4(b) is a cross section depicting a schematic diagram of the conventional multilayer-ceramic-capacitor after the firing.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
FIG. 1 is a cross section depicting a schematic diagram of a multilayer ceramic capacitor in accordance with a first exemplary embodiment of the present invention. FIG. 1 lists up the following elements with numbers: ceramic layer 11, inner electrode 12, conductive section
REFERENCES:
patent: 5735027 (1998-04-01), Hageman et al.
Hioki Yasuhiro
Itakura Gen
Okinaka Hideyuki
Dinkins Anthony
Matsushita Electric - Industrial Co., Ltd.
Reichard Dean A.
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