Method of adhesively and hermetically sealing a semiconductor pa

Details Method of adhesively and hermetically sealing a semiconductor pa Method of adhesively and hermetically sealing a semiconductor pa

1990-04-06

1991-11-12

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

174 525, H01L 21603, H01L 2310

Patent

active

050647822

ABSTRACT:
A semiconductor device package is disclosed which includes (1) a carrier body which is to be mounted with a semiconductor device chip and which has an annular adhesion layer formed thereon, (2) a cap which is to be adhered to the carrier body to hermetically seal the carrier body, and (3) an adhesive which is applied between the adhesion layer of the carrier body and the cap and which becomes hardened after at least one of the carrier body and the cap is pivoted about an axis coaxial with the annular adhesion layer to eliminate voids in the adhesive and to improve the sealing properties of the package.

REFERENCES:
patent: 3711939 (1973-01-01), Stoll
IBM Technical Disclosure Bulletin; vol. 20, No. 4, 9/77, G. Dumaine et al.

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