Patent
1989-12-14
1991-08-20
LaRoche, Eugene R.
357 80, 357 81, 357 72, 357 70, H01L 2342
Patent
active
050419021
ABSTRACT:
A molded package having reduced unintentional and undesirable mold flash or bleed around an exposed heat sink is provided through the use of a compression structure within the package. The compression structure may be integral with a heat sink, die bond flag, if one is present, or may be a separate structure, which extends from a die support surface of the heat sink to the opposite side of the mold. During molding, the compression structure presses a heat dissipation surface of the heat sink against the mold surface forming a tight seal to prevent the mold compound from creeping around between the mold and the heat dissipation surface to form flash. The heat sink may also be provided with adhesion promotion features along its side to improve the physical bond or attachment between the heat sink and the plastic body of the package.
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W. R. DeBoskey, "Directly Attached Integrated Circuit Lead Frame," IBM Technical Disclosure Bulletin, vol. 15, No. 1, Jun. 1972.
Dockrey Jasper W.
Fisher John A.
LaRoche Eugene R.
Motorola Inc.
Ratliff R.
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