Co-fired ceramic package for a power circuit

Details Co-fired ceramic package for a power circuit Co-fired ceramic package for a power circuit

1989-06-01

1991-08-20

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 1705, 174 17GF, 357 74, H01L 2302, H05K 506

Patent

active

050416952

ABSTRACT:
Both a co-fired ceramic package for a power circuit is disclosed as well as a method of manufacture thereof. The package includes a base which is formed from a plurality of pyrolizable ceramic films, each of which includes a heat-conductive and electrically insulative ceramic material such as aluminum nitride, silicon carbide or beryllium oxide embedded within a binder. In the method of the invention, two or three ceramic films are metalized with a pattern of conductive material on their top surfaces. The resulting metalized films are then stacked over a plurality of unmetalized ceramic films, and the resulting aggregate stack is laminated together by the application of heat and pressure. Electrical components are then soldered onto the top surface of the base, and a cover is sealingly connected around the resulting hybrid circuit. The metalization step advantageously forms terminals around the cover which allow access to the heat generating power circuit without the need for glass post seals. The resulting, integrated ceramic structure is free of internal thermal stresses, and affords better heat dissipation characteristics than prior art devices.

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