Method of producing MOS FET type semiconductor device

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29576B, 29578, 29589, 148 15, 148DIG90, 148DIG91, 148DIG141, 357 236, 357 239, 357 91, 427 531, H01L 21268

Patent

active

046464263

ABSTRACT:
In the production of an MOS transistor or a one-MOS transistor one-capacitor memory cell, a gate electrode is made of aluminum, doped regions are formed by an ion-implantation method using the gate electrode as a mask, and the doped regions are annealed by a laser beam.

REFERENCES:
patent: 3514844 (1970-06-01), Bower
patent: 3808472 (1974-04-01), Engeler
patent: 4243433 (1981-01-01), Gibbons
patent: 4270262 (1981-06-01), Hori
patent: 4274193 (1981-06-01), Angle
patent: 4366613 (1983-01-01), Ogura et al.
patent: 4441249 (1984-04-01), Alspector et al.
patent: 4468855 (1984-09-01), Sasaki
Iwamatsu et al., "Silicon on Sapphire MOSFETS Fabricated by Back Surface Laser Anneal Technology" Electronics Letters; vol. 15, No. 25, Dec. 6, 1979.
Iwamatsu et al., "Self Aligned Aluminum Gate MOSFET'S Fabricated by Laser Anneal" J. Electrochem Soc., vol. 28, No. 2, Feb. 1981.
Fowler et al.; "Process for Making MOSFET'S", IBM Tech Disc Bull, vol. 13, No. 11, Apr. 1971, p. 3358.
Esnault et al., "Self Aligned IGFET" IBM Tech Disc Bull, vol. 16, No. 5, Oct. 1973, pp. 1498-1499.
Lever, "Background Heating for Laser Annealing" IBM Tech Disc Bull, vol. 21, No. 10, Mar. 1979, p. 4040.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of producing MOS FET type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing MOS FET type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing MOS FET type semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1009342

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.