Semiconductor device having resin gate hole through substrate fo

Details Semiconductor device having resin gate hole through substrate fo Semiconductor device having resin gate hole through substrate fo

1994-10-24

1997-10-21

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257700, 257787, 257796, H01L 2310, H01L 2331

Patent

active

056799780

ABSTRACT:
A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

REFERENCES:
patent: 5200366 (1993-04-01), Yamada et al.
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5385869 (1995-01-01), Liu et al.
patent: 5394009 (1995-02-01), Loo
patent: 5455456 (1995-10-01), Newman
IBM Technical Disclosure Bulletin, vol. 22, No. 09, Feb. 1980, New York, U.S. p. 3988.

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