Chemistry: electrical and wave energy – Processes and products
Patent
1974-03-18
1976-01-06
Kaplan, G. L.
Chemistry: electrical and wave energy
Processes and products
C25D 358
Patent
active
039309657
ABSTRACT:
The present invention relates to additives for electroplating baths used for the electrodeposition of zinc-copper alloys, and particularly to such alloys designed to be used as undercoats for subsequently applied metal coatings. The improvement comprises additives for incorporation into conventional zinc-copper electrolytes, comprising a mixture of a buffering agent selected from the group consisting of boric acid, alkali metal borates, alkali metal carbonates, alkali metal phosphates and glycine, a metal ion selected from the group consisting of nickel ion and cobalt ion, and ethylenediaminetetra acetic acid (as the alkali metal salt).
REFERENCES:
patent: 2684937 (1954-07-01), Westbrook et al.
patent: 2916423 (1959-12-01), Passal
patent: 2989448 (1961-06-01), France
H. P. Coats, Trans. Electrochem. Soc., Vol. 80, pp. 445-457, (1941).
S. Ramachandran et al., Metal Finishing, pp. 64-68, Nov. 1968.
Kaplan G. L.
McGean Chemical Company, Inc.
LandOfFree
Zinc-copper alloy electroplating baths does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Zinc-copper alloy electroplating baths, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Zinc-copper alloy electroplating baths will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2346719