Zinc-chromium stabilizer containing a hydrogen inhibiting additi

Details Zinc-chromium stabilizer containing a hydrogen inhibiting additi Zinc-chromium stabilizer containing a hydrogen inhibiting additi

1997-09-04

1999-06-01

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming nonmetal coating

205318, 205319, 205243, 205244, 205152, 205155, 205156, C25D 902

Patent

active

059085444

ABSTRACT:
This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

REFERENCES:
patent: 5017271 (1991-05-01), Whewell et al.
patent: 5071520 (1991-12-01), Lin et al.
patent: 5403465 (1995-04-01), Apperson et al.
patent: 5421985 (1995-06-01), Clouser et al.
patent: 5447619 (1995-09-01), Wolski et al.
patent: 5456817 (1995-10-01), Hino et al.

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