Zinc-aluminum solder alloy

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S765000, C257S771000, C257SE23157, C228S183000, C228S223000, C228S262510, C148S688000, C148S701000, C148S705000, C148S441000, C438S688000

Reexamination Certificate

active

07425765

ABSTRACT:
A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.

REFERENCES:
patent: 4389463 (1983-06-01), Smeggil et al.
patent: 4448748 (1984-05-01), Radtke et al.
patent: 6109510 (2000-08-01), Otsuka et al.
patent: 6148515 (2000-11-01), Suzuki et al.
patent: 6563225 (2003-05-01), Soga et al.
patent: 6715667 (2004-04-01), Korischem et al.
patent: 6840434 (2005-01-01), Clay et al.
patent: 0 785 045 (1997-07-01), None
patent: 9-201694 (1997-08-01), None
patent: 10-140307 (1998-05-01), None
patent: 2000-280066 (2000-10-01), None

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