Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-03-21
2008-09-16
Purvis, Sue A. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S765000, C257S771000, C257SE23157, C228S183000, C228S223000, C228S262510, C148S688000, C148S701000, C148S705000, C148S441000, C438S688000
Reexamination Certificate
active
07425765
ABSTRACT:
A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.
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Kitajima Masayuki
Matsuyama Ryoji
Shono Tadaaki
Fujitsu Limited
Purvis Sue A.
Rodela Eduardo A.
Westerman, Hattori, Daniels & Adrian , LLP.
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