Zinc alloy for reducing copper-zinc diffusion

Details Zinc alloy for reducing copper-zinc diffusion Zinc alloy for reducing copper-zinc diffusion

1984-10-01

1986-07-08

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428674, 428926, 428935, 420515, 420516, 204 44, B32B 1501

Patent

active

045992797

ABSTRACT:
A zinc alloy, having a copper layer coated thereon, consists essentially of from about 0.1 to about 0.8 weight percent copper, about 0.01 or more weight percent aluminum; up to about 0.05 weight percent magnesium, the balance being essentially zinc. The copper coated zinc alloy is advantageously employed to produce various cast, extruded, molded articles and the like including trim, fixtures as well as coin blanks. Further, the present invention relates to a metal article comprising a zinc base alloy having a copper overlayer in direct contact with the zinc base alloy, said alloy comprising about 1.5 weight percent or less aluminum and the remainder zinc. From another aspect, the subject invention contemplates a method for reducing the diffusion between a copper layer and a zinc base metal, said layer being in direct contact with the zinc base metal, said method comprising incorporating at least about 0.01 weight percent aluminum in said zinc base metal. The invention also contemplates a method for reducing the interdiffusion between a copper electroplate bonded to an underlying zinc metal comprising alloying said zinc metal with about 0.1 to about 0.8 weight percent copper, about 0.01 or more weight percent aluminum, about 0.003 to about 0.05 weight percent magnesium, the balance being essentially zinc, said copper electroplate having a thickness of at least of about 0.00001 inch.

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