Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1989-05-05
1990-07-24
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439267, 439634, H01R 2370
Patent
active
049432427
ABSTRACT:
A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulative strip carrying a plurality of buckling beams electrically isolated from each other. The beams are aligned on the plane defining the strip in parallel with ends extending away from the strip edges in opposing directions. Means are provided for deforming the strip within the housing prior to effecting desired interconnections whereby the beams are pre-buckled. Upon urging contacts into proximity with the beam ends, the buckling force is released causing each beam's ends to be urged away from the strip into engagement with respective contacts, thereby effecting desired interconnection between contacts and through one or more beams.
REFERENCES:
patent: 4540229 (1985-10-01), Madden
patent: 4622514 (1986-11-01), Lewis
patent: 4793814 (1988-12-01), Zifcak et al.
"Engineering Mechanics of Deformation Bodies", 2d Ed., Chapter 11, pp. 273-315, Snyder Byars.
IBM Technical Disclosure Bulletin, vol. 17, No. 2, Jul. 1974, pp. 440-441, "High-Density Double-Contact Zero Insertion Force Connector".
IBM Technical Disclosure Bulletin, vol. 17, No. 2, Jul. 1974, pp. 442-443, "Zero Insertion Connector with Individually Replaceable Contacts".
IBM Technical Disclosure Bulletin, vol. 17, No. 2, Jul. 1974, pp. 444-445, "Pin Pad Contactor".
Frankeny Richard F.
Haj-Ali-Ahmadi Javad
Imken Ronald L.
Wustrau Rolf
Abrams Neil
Carwell Robert M.
International Business Machines - Corporation
LandOfFree
Zero insertion force high density connector system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Zero insertion force high density connector system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Zero insertion force high density connector system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1265715