Zero current draw circuit for use during a bonding option

Miscellaneous active electrical nonlinear devices – circuits – and – Specific identifiable device – circuit – or system – With specific source of supply or bias voltage

Patent

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Details

327387, 326 38, G05F 302

Patent

active

059202270

ABSTRACT:
A circuit that is coupled to a bonding pad of an integrated circuit structure for reducing the leakage current through the structure to approximately zero when a bonding option is selected. The current path through the integrated circuit structure is removed by turning off a circuit element upon application of a control signal from the integrated circuit structure.

REFERENCES:
patent: 4490634 (1984-12-01), Hareyama
patent: 5412333 (1995-05-01), Okunaga
patent: 5420526 (1995-05-01), Fensch

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