Z-pin reinforced bonded composite repairs

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156 94, 156 92, 428 63, 428223, B29C 7310, B32B 708, B32B 3500

Patent

active

058688862

ABSTRACT:
The strength of composite patches is improved over conventional bolted or bonded patches by including Z-pins in the patch/parent structure interface to provide a mechanical link with small stress concentration between the patch and the parent structure. In some cases, we achieve a stronger repair removing the pins to leave holes that fill with resin from the patch during the curing or bonding operation.

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