Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-12-22
1999-02-09
Stemmer, Daniel
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 94, 156 92, 428 63, 428223, B29C 7310, B32B 708, B32B 3500
Patent
active
058688862
ABSTRACT:
The strength of composite patches is improved over conventional bolted or bonded patches by including Z-pins in the patch/parent structure interface to provide a mechanical link with small stress concentration between the patch and the parent structure. In some cases, we achieve a stronger repair removing the pins to leave holes that fill with resin from the patch during the curing or bonding operation.
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Alston Mark S.
Brown Joseph P.
Childress James J.
Hammar John C.
Stemmer Daniel
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