Z-interface-board

Details Z-interface-board Z-interface-board

1994-01-27

1996-10-01

Abrams, Neil

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 361790, H05K 702

Patent

active

055615937

ABSTRACT:
A z-interface-board includes an array of vias or holes for interconnecting z-plane modules with other electronic components. The vias are plated with an electrically conductive material to create conductive elements or connecting contacts on both sides of the board. The plating can be manipulated to form different contact configurations at the vias. Different types of tops for the vias on one side of the board may be used for mating with other electronic components. Different types of bottoms for the vias on the other side of the board may be used for mounting the interface board to the z-plane module. The interface board provides a flat wafer-like surface for allowing process development including indium bump bonding. After the process development, the interface board is mounted to a stacked z-plane module. This final mounting may be performed by hard solder bumps or pins, instead of the soft indium bumps.

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