Z-interconnections with liquid crystal polymer dielectric films

Details Z-interconnections with liquid crystal polymer dielectric films Z-interconnections with liquid crystal polymer dielectric films

2006-10-31

2006-10-31

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

Reexamination Certificate

active

07128256

ABSTRACT:
A multilayered stack and method of formation. First and second dielectric layers are formed, respectively including first and second liquid crystal polymer (LCP) dielectric materials, with an electrically conductive plug through the first dielectric layer. A first and second electrical circuitization is formed in direct mechanical contact with a surface of the first and second dielectric layer, respectively, wherein the second electrical circuitization mechanically and electrically contacts an end of the plug, and wherein the plug is fluxlessly soldered to the first electrical circuitization. The first and second dielectric layers and the first electrical circuitization are subjected to a temperature below the lowest nematic-to-isotropic transition temperature of the first and second LCP dielectric materials, for a dwell time and elevated pressure sufficient to cause the first and second LCP dielectric materials to directly bond the second dielectric layer to the first dielectric layer and to the first electrical circuitization.

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patent: 6451710 (2002-09-01), Oka et al.
patent: 6528145 (2003-03-01), Berger et al.

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