Z-axis interconnect for discrete die burn-in for nonpackaged die

Details Z-axis interconnect for discrete die burn-in for nonpackaged die Z-axis interconnect for discrete die burn-in for nonpackaged die

1991-11-05

1995-08-08

Nguyen, Vinh

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R 3102

Patent

active

054402409

ABSTRACT:
A reusable burn-in/test fixture for discrete die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. Electrical contact with bondpads or bumps on the die is established through a Z-axis anisotropic conductive interconnect material. When the two halves are assembled, electrical contact with the die is established. The fixture establishes the electrical contact and with a burn-in oven and with a discrete die tester. The test fixture need not be opened until the burn-in and electrical tests are completed. The fixture permits the die to be characterized prior to assembly, and the Z-axis anisotropic conductive interconnect material permits the die to then be transferred in an unpackaged form.

REFERENCES:
patent: 4340860 (1982-07-01), Teeple, Jr.
patent: 4554505 (1985-11-01), Zachry
patent: 4560216 (1985-12-01), Egawa
patent: 4729166 (1988-03-01), Lee et al.
patent: 4739257 (1988-04-01), Jenson et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4996476 (1991-02-01), Balyasny et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5302891 (1994-04-01), Wood et al.
"Known-Good Die: A Key to Cost-Effective MCMs", Cloud et al., Electronic Packaging and Production, Sep. 1992.
Military Sram Die, Micron Military Products Data Book, 1992, pp. 61-614.

Affiliated with

Also associated with

Rating

Z-axis interconnect for discrete die burn-in for nonpackaged die does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Z-axis interconnect for discrete die burn-in for nonpackaged die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Z-axis interconnect for discrete die burn-in for nonpackaged die will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-974003