Z-axis dimensional control in manufacturing an LED printhead

Details Z-axis dimensional control in manufacturing an LED printhead Z-axis dimensional control in manufacturing an LED printhead

1991-03-04

1995-09-26

Fuller, Benjamin R.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156299, 156556, 156560, 347238, B32B 3100, G01D 942

Patent

active

054531454

ABSTRACT:
LED dice and driver chips for generating current for driving LED's are to be mounted on tile modules. Z-axis dimensional control of the LED dice and driver chips is provided by placement of the dice and driver chips face down in a first fixture member to locate the dice against a first datum on the fixture. A front face of the tile is accurately positioned in the x, y plane relative to the dice and driver chips and supported in a second fixture member. The front face of the tile contains adhesive for attachment of the tile to the LED dice and driver chips. The rear face of the tile is located against a second datum in the fixture that is located a fixed distance from the first datum. Thus, the adhesive between the dice and the front face of the tile compensates for the thickness variations of both the dice and the tile.

REFERENCES:
patent: 3666588 (1972-05-01), Wanesky
patent: 3771871 (1973-11-01), Rattman
patent: 3969173 (1976-07-01), Amberg et al.
patent: 4280786 (1981-07-01), Dyche
patent: 4942405 (1990-07-01), Dody et al.
patent: 4999077 (1991-03-01), Drake et al.

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