Z-axis compliant mechanical IC wiring substrate and method for m

Details Z-axis compliant mechanical IC wiring substrate and method for m Z-axis compliant mechanical IC wiring substrate and method for m

1994-09-20

1995-07-18

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257737, 257774, 257785, 439 91, H01L 2952, H01L 2960

Patent

active

054344522

ABSTRACT:
A compliant integrated circuit (IC) wiring substrate (10) has an insulative carrier film (14) and a plurality of micro-beam conductors (12) in the carrier film. Each of the plurality of micro-beam conductors has a pair of contact bumps (16 and 18) connected to respective posts (22 and 24). A beam element (20) connects the pair of contact bumps and posts at opposing ends and opposing surfaces of the beam element. The plurality of micro-beam conductors extend through the thickness of the carrier film such that the pair of contact bumps protrude from the opposite surfaces of the carrier film. The compliance of the wiring substrate can be varied by varying locations of apertures in the insulative carrier film.

REFERENCES:
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4793814 (1988-12-01), Zifeak et al.
patent: 4932883 (1990-06-01), Hsia et al.
patent: 5117069 (1992-05-01), Higgins
patent: 5140405 (1992-08-01), King et al.
patent: 5147210 (1992-09-01), Patterson et al.
"Area Array Modular I/O Pad to Printed Circuit Board I/O Pad Interconnection Device," IBM Technical Disclosure Bulletin, vol. 27, No. 12, May 1985, pp. 7115-7117.

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