Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-03-06
2003-02-11
Schuberg, Darren (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S702000, C361S707000, C257S706000, C257S709000, C174S016300
Reexamination Certificate
active
06519152
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a yarn processing system
BACKGROUND OF THE INVENTION
Yarn processing systems, which the invention refers to, may be not only yarn feeders, but e.g. also accessory devices used for yarn processing that supply textile machines, such as weaving or knitting machines, with yarn and comprise at least one electrically driven component and a control circuit assigned thereto. Apart from yarn feeders, such devices may be yarn impregnating means or yarn lubricators, controlled yarn brakes and yarn tensioners, slip-type conveyors for yarn, rotary drives for yarn supply coils, or the like. The control circuit may be positioned in the housing of the yarn feeder or the accessory device, or in a separate housing of the yarn feeder or the accessory device, or in a separate housing which, nevertheless, has to be regarded as part of the yarn processing system.
In a yarn feeder known from DE-C-265 18 57, the control circuit of the drive motor comprises effect transistors as semiconductor components. The control circuit is normally arranged in the housing, with the effect transistors being positioned on the printed circuit board. During operation the semiconductor components generate heat which during prolonged operation leads to a relatively high heat level that impairs the service life of the control circuit, in particular of the semiconductor components.
In yarn feeders it is known from prior use in practice (
FIG. 1
) that heat-generating semiconductor components, such as effect transistors, are positioned on the edge portion of the printed circuit board and that a strip-like heat conducting body is mounted in the housing or on the printed circuit board in the vicinity of the semiconductor components, with portions of the semiconductor components being pressed against said heat conducting body by clamping elements. The heat conducting body, in turn, is mounted in heat transmitting contact with the housing.
This is troublesome from a constructional point of view and, with respect to the equipment of the printed circuit board, requires inexpedient upright positions of the semiconductor components because the latter must project upwards from their bondings with the printed circuit board to contact the heat conducting body. Moreover, contact with the heat conducting body is established some distance away from the hottest portion of the semiconductor component which normally lies near the bondings and thus radiates a lot of heat into the environment, said heat being not absorbed by the heat conducting body. The inexpensive so-called “surface mounting”, e.g. by assembling robots, can therefore not be employed for said semiconductor components. In this expedient mounting technique, semiconductor components are secured in a lying position with one of their surfaces to an adhesive surface of the printed circuit board, i.e. either in addition to the bondings or even for creating a bonding or grounding.
It is known from EP-A-0 116 396 that electronic subassemblies which can be stacked one upon the other are each designed such that two rigid plates consisting of heat-conducting metal clamp a printed circuit board with semiconductor components arranged thereon between themselves. The two outer plates are urged together by C-clips provided at the edge side or by clamping screws. At least one plate has provided thereon projections which extend through openings into the printed circuit board from below up to the semiconductor components. Since the plates substantially correspond to the printed circuit board in size, their heat absorbing capacity is limited.
US-5-A-812 375, which is of an older time rank, suggests an electronic subassembly which consists of at least one printed circuit board equipped with semiconductor components and of an encapsulation consisting of two shells, the base of the encapsulation consisting of heat conducting material and comprising at least one projection that projects into an opening of the printed circuit board up to the neighborhood of an insulating layer carrying a semiconductor component to be cooled. Said encapsulated subassembly forms a unit in which the base of the encapsulation has only a limited heat absorbing capacity.
It is the object of the present invention to provide a yarn processing system of the above-mentioned type in which a low temperature level can be obtained in the control circuit in a constructionally simple, inexpensive and space-saving way, optionally even by applying the surface mounting technique for the semiconductor components.
Heat generated by the semiconductor component is dissipated in a highly efficient manner by physical heat transmission through the printed circuit board into the housing or housing part. The projection can easily be shaped during formation of the housing. The semiconductor component is cooled in a particularly expedient manner near the bondings, i.e. near the place of origin of heat, because the prolongation can extend through the printed circuit board to the place of origin. Heat accumulation between the semiconductor component and the printed circuit board is also avoided because a physical heat conducting path is created, extending from the semiconductor component into the housing. The temperature of the semiconductor component and the control circuit can thereby be reduced considerably, which is of benefit to operational safety and to the service life of the control circuit. The housing may be the housing of the yarn feeder or of an accessory device, which as the housing of the yarn processing device has a very high heat absorbing capacity thanks to its size and mass.
The prolongations forming the heat dissipating body are e.g. block- or pin-shaped, which is simple with respect to technical production, and are integral with the housing or housing part. The prolongations can already be realized during formation of the housing or housing part, which will considerably simplify assembly at a later time. The prolongation expediently penetrates through an opening or cutout of the printed circuit board, which has specifically been formed for said purpose, the prolongation engaging into the opening or cutout in a relatively accurately fitting manner or with a play on all sides. In the case of large semiconductor components several prolongations could perform a joint cooling action.
An intermediate material which is inserted between the semiconductor component and the prolongation and which is suitably elastic at least to some extent improves heat dissipation, for it may be difficult to achieve full contact between hard or metallic surfaces. The intermediate material is capable of compensating for wrong positions caused by the production process or thermally between the heat dissipating surfaces.
Suitably, the intermediate layer is an electrically insulating pad (e.g. gap pad) of a highly heat-conducting material, an adhesive or filler coat (e.g. silicone plastics), or a flexible carrier impregnated with an adhesive agent (e.g. a self-adhesive insulating tape.
Thanks to the prolongation which for cooling purposes extends through the printed circuit board to the semiconductor component (with or without intermediate layer), the semiconductor component to be cooled can advantageously be mounted according to the so-called surface mounting technique on the printed circuit board, i.e. in an automatic mounting device and/or with assembly robots.
Advantageously, the semiconductor component is acted upon by an abutment at the side opposite to the prolongation. This is of advantage for various reasons.
The abutment can produce a force equilibrium in a non-positive manner with the prolongation pressing against the semiconductor components, so that the connection portion of the semiconductor component with the printed circuit board or the bondings is not subjected to any undesired loads. Moreover, the contact pressure between prolongation and semiconductor component can be adjusted by means of the abutment. Finally, the printed circuit board can be positioned and secured in its position
Datskovsky Michael
Flynn ,Thiel, Boutell & Tanis, P.C.
Iropa AG
Schuberg Darren
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