X-ray mask and a manufacture method therefor

Details X-ray mask and a manufacture method therefor X-ray mask and a manufacture method therefor

1987-08-14

1989-10-10

Dees, JoseG.

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

430296, 430323, 378 35, G03F 100

Patent

active

048731625

ABSTRACT:
An x-ray mask for x-ray lithography has an x-ray absorber pattern which is formed from a Ti-W alloy with a Ti content of 0.5-10 weight %. A method for the manufacture of the x-ray mask comprises sequentially forming a first film, a Ti-W alloy film with a Ti content of approximately 0.5-10 weight %, and a third film on a mask substrate and coating the third film with an electron beam-sensitive resist, exposing the resist to an electron beam and then developing the exposed resist to form a resist pattern, using the resist pattern as a mask and selectively etching the third film to form a pattern, and using the pattern as a mask and selectively etching the Ti-W alloy film with a reactive gas to form an absorber pattern. The Ti-W alloy film is preferably formed by sputtering in an atmosphere of argon and nitrogen gas with a nitrogen content of approximately 30-50%, whereby nitrogen is included in the Ti-W alloy film.

REFERENCES:
patent: 4037111 (1977-07-01), Coquin et al.
patent: 4719161 (1988-01-01), Kimura et al.
patent: 4722878 (1988-02-01), Watakabe et al.
Karnezos et al., "Tungsten: An Alternative to Gold for X-Ray Masks", J. Vac. Sci. Technol. B 5(1), Jan./Feb. 1987, pp. 283-287.
Maldonado et al., "Thin Film Structure to Reduce Radiation Damage in X-Ray Lithography", J. Vac. Sci. Technol. B 5(1), Jan./Feb. 1987, pp. 248-252.

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