Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2006-02-21
2009-12-29
Ward, Jessica L. (Department: 1793)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C228S008000, C382S150000
Reexamination Certificate
active
07637413
ABSTRACT:
A X-ray inspection device for inspecting a solder connection portion between a circuit device having a solder ball and a printed circuit board having a land includes: X-ray irradiating means for irradiating X-ray to the solder connection portion between the solder ball and the land; X-ray detecting means for detecting the X-ray transmitted through the solder connection portion and for outputting a detection signal; and image forming means for forming and outputting a horizontal tomographic image of the solder connection portion on the basis of the detection signal. The horizontal tomographic image shows existence or nonexistence of a solder bump disposed on a side of the land.
REFERENCES:
patent: 4852131 (1989-07-01), Armistead
patent: 5719952 (1998-02-01), Rooks
patent: 6657135 (2003-12-01), Suetsugu et al.
patent: 6823040 (2004-11-01), Teraoka
patent: 2003/0173666 (2003-09-01), Taniguchi et al.
patent: A-2003-240736 (2003-08-01), None
patent: A-2004-212200 (2004-07-01), None
patent: WO 99/64882 (1999-12-01), None
patent: WO 01/35051 (2001-05-01), None
Search Report dated Dec. 21, 2007 in corresponding Spanish application No. 200600457.
Office Action dated Oct. 8, 2008 in corresponding Spanish patent application No. 200600457 (and English translation).
Office Action dated Dec. 19, 2008 in corresponding Chinese patent application No. 200610019831.9 (and English translation).
Office Action dated May 8, 2009 in corresponding Spanish patent application No. 200600457 (and English translation).
Hasegawa Hisashi
Hayashi Yoshinori
Hiramatsu Tomoyuki
D'Aniello Nicholas P
DENSO CORPORATION
Posz Law Group , PLC
Ward Jessica L.
LandOfFree
X-ray inspection device and X-ray inspection method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with X-ray inspection device and X-ray inspection method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and X-ray inspection device and X-ray inspection method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4073946