Writing on silicon wafers

Details Writing on silicon wafers Writing on silicon wafers

1993-04-09

1994-07-12

Albritton, C. L.

Electric heating

Metal heating

By arc

21912178, B23K 2600

Patent

active

053290909

ABSTRACT:
Surfaces of silicon wafers used in making computer chips are marked by dimples engraved by pulses of radiation from a Nd:YAG or Nd:YLF laser pumped by diode lasers (commonly called a DPY laser). A beam of radiation from the DPY laser is focused on and moved across the surface of a wafer so as to produce dimples in a cluster positioned on a microgrid subdividing elements of a dot-matrix representation of a text written in alpha-numeric or bar-code characters.

REFERENCES:
patent: 5109149 (1992-04-01), Leung

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