Coating implements with material supply – Including tool with blade-like – pad-like – or apertured... – Apertured tool
Patent
1982-10-29
1985-07-30
Bratlie, Steven A.
Coating implements with material supply
Including tool with blade-like, pad-like, or apertured...
Apertured tool
401198, 401199, 401292, B43K 110
Patent
active
045318530
ABSTRACT:
A writing instrument has a metal writing point formed by a bundle of fine metal wires, which at one end portion of the bundle are laterally compressed and held adjacent to each other with capillary passages between them. A substantially hemispherical tip is formed at the end surface of the end portion and a substantial part of the remainder of the bundle has a longitudinally extending hollow space at the center thereof. A long permeable ink feeding core is inserted into a hollow space for feeding ink to the passages in the tip and the bundle is encased in a cylinder which may be incorporated in a pen having an ink cartridge from which ink is supplied to the core. The compressed wires are durable and can be provided with a smooth hemispherical surface which moves smoothly over the paper. The passages and the core ensure a steady supply of ink. The writing point also enables sufficient pressure to be applied when writing for making copies with carbon or copy paper.
REFERENCES:
patent: 3306267 (1967-02-01), Matsumoto
patent: 3338216 (1967-08-01), Roller, Sr.
patent: 3361516 (1968-01-01), Rigondaud
patent: 3399021 (1968-08-01), Matsumoto
patent: 3510934 (1970-05-01), Koelichen
Hirabayashi Masao
Mizutani Takeshi
Bratlie Steven A.
Shachihata Industry Co., Ltd.
LandOfFree
Writing instrument with a metal wire point does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Writing instrument with a metal wire point, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Writing instrument with a metal wire point will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2369845