Write data input circuit

Static information storage and retrieval – Addressing – Including particular address buffer or latch circuit...

Reexamination Certificate

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Details

C365S222000, C365S233100

Reexamination Certificate

active

06295245

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to semiconductor memory devices, and more particularly, to write data input circuits used in semiconductor memory devices such as double data rate (DDR) SDRAMs.
DDR SDRAMs have been proposed in recent years to further increase the data transmission rate.
A conventional SDRAM acquires an external command in synchronism with a clock signal. If the external command is, for example, a write command, the prior art SDRAM receives the corresponding write data in synchronism with the rising edge of the clock signal.
In contrast, the DDR SDRAM acquires the write data in synchronism with both the rising and falling edges of a data strobe signal. More specifically, the DDR SDRAM acquires the write command in synchronism with the clock signal, and then receives the write data in synchronism with the rising edge of the data strobe signal. The data strobe signal is output at around the time when the clock signal following the clock signal which acquires the write command goes high. Accordingly, the DDR SDRAM acquires the write data at a transmission rate which is two times faster than that of the conventional SDRAM.
FIG. 1
is a schematic block diagram showing the DDR SDRAM
100
. As shown in
FIG. 1
, the DDR SDRAM
100
includes an external command input buffer
51
, an external command latch circuit
52
, a clock signal input buffer
53
, a command decoder
54
, an internal command latch circuit
55
, a data strobe signal input buffer
56
, a data input buffer
57
, a first data latch circuit
58
, and a second data latch circuit
59
.
The external command input buffer
51
receives an external command COM from an external device (not shown) and provides the external command COM to the external command latch circuit
52
. The external command latch circuit
52
latches the external command COM in synchronism with the rising of the clock signal provided from the clock signal input buffer
53
.
The latched command COM is decoded by the command decoder
54
. The decoded command COM is latched by the internal command latch circuit
55
as an internal command and provided to an internal circuit.
If the latched internal command is a write command, the internal command latch circuit
55
provides the data strobe signal input buffer
56
and the data input buffer
57
with an enable signal WRTZ. The data strobe signal input buffer
56
is activated in response to the enable signal WRTZ, receives a data strobe signal DQS having a rectangular wave from an external device, and provides the first and second data latch circuits
58
,
59
with the data strobe signal DQS.
The data input buffer
57
is also activated by the enable signal WRTZ. The data input buffer
57
sequentially receives write data DQ (D
1
, D
2
) from an external device and provides the first and second data latch circuits
58
,
59
with the write data DQ (D
1
, D
2
) in accordance with the rising and falling edges of the data strobe signal DQS. The first data latch circuit
58
latches the write data DQ (D
1
) from the data input buffer
57
in synchronism with the rising of the data strobe signal DQS. The second data latch circuit
59
latches the write data DQ (D
2
) from the data input buffer
57
in synchronism with the falling of the data strobe signal DQS. The latched write data D
1
, D
2
is sent to a DRAM core circuit (not shown) and written to a memory cell at predetermined addresses.
FIG. 2
is a timing chart showing the behavior of the clock signal CLKZ and the data strobe signal DQS of the write command. As shown in
FIG. 2
, the external command COM is latched by the clock signal CLKZ. The data strobe signal DQS rises within a range of ±25% of a single cycle tCLK from the rising of the clock signal CLKZ.
In other words, when a single cycle of the clock signal CLKZ is represented as tCLK, the time between the rising of the clock signal CLKZ that latches the external command COM and the earliest rising of the data strobe signal DQS, or the minimum time tDQSSmin, is represented as tDQSSmin=0.75 tCLK (nanoseconds).
The time until the latest rising of the data strobe signal DQS, or the maximum time tDQSSmax, is represented as tDQSSmax=1.25 tCLK (nanoseconds).
If a single cycle tCLK of the clock signal CLKZ takes ten nanoseconds (the frequency of the clock signal CLKZ being 100 megahertz), the minimum time tDQSSmin and the maximum time tDQSSmax are obtained as described below.
tDQSS
min=0.75
tCLK=
7.5 (nanoseconds)
tDQSS
max=1.25
tCLK=
12.5 (nanoseconds)
Accordingly, the strobe signal input buffer
56
and the data input buffer
57
must be activated presuming that the data strobe signal DQS rises at the minimum time tDQSSmin.
The determination of whether the data strobe signal DQS is low prior to the rising of the strobe signal DQS must be completed by the data strobe signal input buffer
56
before the minimum time tDQSSmin (0.75 tCLK) elapses. Furthermore, since the data strobe signal input buffer
56
is generally formed by a current mirror circuit, a certain amount of time is necessary to activate the data strobe signal input buffer
56
from a deactivated state.
The time necessary for the data strobe input buffer
56
to determine whether the data strobe signal DQS is low can be represented as T
11
, and the time necessary for activating the data strobe signal input buffer
56
can be represented as T
12
. In this case, at least time T
11
+T
12
is necessary prior to the rising of the data strobe signal DQS when the data strobe signal input buffer
56
receives the enable signal WRTZ.
In other words, at least a first guarantee time Ta is necessary from when the clock signal CLK, which latched the write command, rises to when the enable signal WRTZ rises. This can be represented as Ta=0.75 tCLK—(T
11
+T
12
) (nanoseconds).
If a single cycle tCLK of the clock signal CLKZ takes ten nanoseconds, the first guarantee time Ta is obtained as described below.
Ta=
7.5−(T
11
+T
12
)(nanoseconds)
The setup time of the first and second data latch circuits
58
,
59
must be provided for between the activation of the data input buffer
57
and the rising of the data strobe signal DQS. Furthermore, in the same manner as the data strobe signal input buffer
56
, the data input buffer
57
is generally formed by a current mirror circuit and requires a certain amount of time before activation.
The setup time of the first and second data latch circuits
58
,
59
may be represented as T
21
and the time necessary for activating the data input buffer
57
may be represented as T
22
. In this case, at least time T
21
+T
22
is necessary prior to the rising of the data strobe signal DQS when the data input buffer
57
receives the enable signal WRTZ.
In other words, at least a second guarantee time Tb is necessary from when the clock signal CLK, which latched the write command, rises to when the enable signal WRTZ rises. This can be represented as Tb=0.75 tCLK−(T
21
+T
22
) (nanoseconds).
If a single cycle tCLK of the clock signal CLKZ takes ten nanoseconds, the second guarantee time Tb is obtained as described below.
Tb=
7.5−(T
21
+T
22
)(nanoseconds)
The time from when the clock signal CLK, which has latched the write command, rises to when the enable signal WRTZ is output, or the accumulated delay time Tc, is determined by a delay time T
31
of the external command input buffer
51
and the clock signal input buffer
53
, a latching time T
32
of the external command latch circuit
52
, a decoding time T
33
of the command decoder
54
, and the latching time T
34
of the internal command latch circuit
55
.
In other words, the accumulated delay time Tc can be represented as Tc=T
31
+T
32
+T
33
+T
34
(nanoseconds).
If T
11
takes 0.5 nanoseconds and T
12
takes 1.5 nanoseconds when a single cycle of the clock signal CLKZ takes ten nanoseconds (the frequency being 100 megahertz), the first guarantee time Ta is obtained as described

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