Wrap-around interconnect for fine pitch ball grid array

Details Wrap-around interconnect for fine pitch ball grid array Wrap-around interconnect for fine pitch ball grid array

1997-12-19

2000-09-19

Meier, Stephen D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257698, 361720, 361736, H05K 334

Patent

active

06121678&

ABSTRACT:
An apparatus and method for producing a wrap-around interconnect substrate (60) comprising a substrate (42) having semi-circular vias (62) having openings (64) created by separating through cylindrical vias (62) that were positioned along cutting lines (46a, 46b) that formed part of an integrated circuit substrate strip (40) prior to separation, is disclosed.

REFERENCES:
patent: 4288841 (1981-09-01), Gogal
patent: 4420652 (1983-12-01), Ikeno
patent: 4939792 (1990-07-01), Urbish
patent: 5635670 (1997-06-01), Kubota et al.
patent: 5725640 (1998-03-01), Joshi
patent: 5729896 (1998-03-01), Dalal et al.

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