Wrap-around cooling arrangement for printed circuit board

Details Wrap-around cooling arrangement for printed circuit board Wrap-around cooling arrangement for printed circuit board

2005-04-19

2005-04-19

Tolin, Gerald (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S185000, C361S704000

Reexamination Certificate

active

06882536

ABSTRACT:
A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board (“PCB”) having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a first to-be-cooled component coupled to said second side of said PCB; and a thermal jumper to thermally couple said first component on said second side to said heat sink on said first side, said jumper being configured to extend physically around a side edge of said PCB.

REFERENCES:
patent: 5184283 (1993-02-01), Hamel
patent: 5237485 (1993-08-01), Cognetti de Martiis et al.
patent: 5272599 (1993-12-01), Koenen
patent: 5513073 (1996-04-01), Block et al.
patent: 6025992 (2000-02-01), Dodge et al.
patent: 6025993 (2000-02-01), Wakabayashi et al.
patent: 6259602 (2001-07-01), Malhammar
patent: 6349035 (2002-02-01), Koenen
patent: 1194172 (1970-06-01), None

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