Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-08-27
2000-08-08
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 361707, 361720, 257707, 257713, 174 163, 165 803, H05K 720
Patent
active
061010936
ABSTRACT:
An electronic assembly which includes a heat sink that is attached to a substrate by a clip. The assembly includes an integrated circuit package that is mounted to the substrate. The clip has an arm which extends around an edge of the substrate and attaches the heat sink to the substrate. The clip also presses the heat sink into the package. Attaching the heat sink directly to the package may reduce the flatness requirements of the sink and the cost of producing the assembly.
REFERENCES:
patent: 4587595 (1986-05-01), Staples
patent: 5237485 (1993-08-01), Martiis et al.
patent: 5815371 (1998-09-01), Jeffries et al.
patent: 5847928 (1998-12-01), Hinshaw et al.
patent: 5870288 (1999-02-01), Chen
Crocker Michael T.
Wong Thomas J.
Datskovsky Michael
Intel Corporation
Picard Leo P.
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