Package making – With contents treating – Reshaping
Reexamination Certificate
2005-07-18
2008-11-11
Huynh, Louis K (Department: 3721)
Package making
With contents treating
Reshaping
C053S431000, C053S435000
Reexamination Certificate
active
07448186
ABSTRACT:
A multi-layered wound dressing includes a moisture-retaining portion for enhancing the healing of a wound. The wound dressing includes an intermediate layer that has both water soluble and water insoluble fibers. An apparatus that includes a cutting tool and a reservoir of liquid to pre-moisten a portion of the dressing may be used to manufacture the dressings.
REFERENCES:
patent: 3140572 (1964-07-01), Petersen et al.
patent: 3729892 (1973-05-01), Aslund et al.
patent: 4522203 (1985-06-01), Mays
patent: 4630426 (1986-12-01), Gentry
patent: 5489437 (1996-02-01), Marra
patent: 5681579 (1997-10-01), Freeman
patent: 5762620 (1998-06-01), Cartmell et al.
patent: 5899871 (1999-05-01), Cartmell et al.
patent: 6062285 (2000-05-01), Dotta et al.
patent: 6655112 (2003-12-01), Cremer et al.
patent: 6753454 (2004-06-01), Mello et al.
patent: 6765123 (2004-07-01), de Jong et al.
patent: 6967261 (2005-11-01), Soerens et al.
patent: 2006/0020235 (2006-01-01), Siniaguine
patent: 2006/0034816 (2006-02-01), Davis et al.
International Search report, PCT/US05/25362, mailing date Sep. 01, 2006.
Written Opinion of the International Searching Authority, PCT/US05/25362.
International Search Report, PCT/US08/50762, mailing date Jun. 25, 2008.
Written Opinion of the International Searching Authority, PCT/US08/50762.
Huynh Louis K
MacPherson Kwok & Chen & Heid LLP
PolyRemedy, Inc.
LandOfFree
Wound dressing and apparatus for forming same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wound dressing and apparatus for forming same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wound dressing and apparatus for forming same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4050999