Workpiece support

Details Workpiece support Workpiece support

1991-05-14

1993-02-02

Yuen, Henry C.

Heating

Processes of heating or heater operation

Including preparing or arranging work for heating

432231, 432249, 432253, F27D 500

Patent

active

051834022

ABSTRACT:
An apparatus for supporting a workpiece has an enclosure, a means for reducing the pressure and a platen on which the workpiece is mounted. A heating mechanism is located within the platen and the platen is coated with a high emissivity material, which facilitates the radiative heat transfer between the platen and the workpiece. Consequently, the workpiece can be rapidly raised to a specific temperature. This apparatus is particularly applicable to the supporting of a semiconductor wafer within a vacuum system.

REFERENCES:
patent: 2798716 (1957-07-01), Pugh
patent: 3951587 (1976-04-01), Alliegro et al.
patent: 4259061 (1981-03-01), Dubetsky
patent: 4610628 (1986-09-01), Mizushina
patent: 4613305 (1986-09-01), Sakurai
patent: 5044943 (1991-09-01), Bowman et al.

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