Workpiece chuck

Details Workpiece chuck Workpiece chuck

1998-07-14

2000-02-01

Leo, Leonard

Heat exchange

With retainer for removable article

165 802, 165 82, 165185, 118728, 269 21, 269903, F28F 700, B25B 1100

Patent

active

060191643

ABSTRACT:
A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

REFERENCES:
patent: 3744560 (1973-07-01), Sell, Jr.
patent: 4462462 (1984-07-01), Meagher et al.
patent: 4607220 (1986-08-01), Hollman
patent: 4682857 (1987-07-01), Tan
patent: 4734872 (1988-03-01), Eager et al.
patent: 4893914 (1990-01-01), Hancock et al.
patent: 5028989 (1991-07-01), Naganuma et al.
patent: 5610529 (1997-03-01), Schwindt

Affiliated with

Also associated with

Rating

Workpiece chuck does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Workpiece chuck, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Workpiece chuck will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-930731