Working method for an optical device wafer

Details Working method for an optical device wafer Working method for an optical device wafer

2009-07-09

2010-06-29

Linsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S455000, C438S461000

Reexamination Certificate

active

07745311

ABSTRACT:
A dividing method for an optical device wafer includes a protective plate adhering step of releasably adhering the surface of an optical device wafer to the surface of a protective plate, a reverse face grinding step of grinding the reverse face of the optical device wafer, a dicing tape sticking step of sticking the reverse face of the optical device wafer on the surface of a dicing tape, a protective plate grinding step of grinding the reverse face of the protective plate adhered to the optical device wafer stuck on the dicing tape so as to have a predetermined thickness, a laser working step of irradiating a laser beam upon the protective plate along the streets formed on the optical device wafer to carry out laser working, which forms break starting points along the streets, for the protective plate, and a wafer dividing step of applying external force to the protective plate to break the protective plate along the break starting points to break the optical device wafer along the streets thereby to divide the optical device wafer into the individual optical devices.

REFERENCES:
patent: 7601616 (2009-10-01), Morikazu et al.
patent: 7622366 (2009-11-01), Nakamura
patent: 2005/0009301 (2005-01-01), Nagai et al.
patent: 2009/0124063 (2009-05-01), Nakamura
patent: 2009/0142906 (2009-06-01), Nakamura
patent: 2009/0197395 (2009-08-01), Nakamura et al.
patent: 2009/0215245 (2009-08-01), Nakamura
patent: 2009/0298263 (2009-12-01), Watanabe et al.
patent: 2009/0311848 (2009-12-01), Hoshino et al.
patent: 2010/0035408 (2010-02-01), Hoshino et al.
patent: 2010/0041210 (2010-02-01), Hoshino et al.
patent: A 10-305420 (1998-11-01), None
patent: A 2008-6492 (2008-01-01), None

Affiliated with

Also associated with

Rating

Working method for an optical device wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Working method for an optical device wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Working method for an optical device wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4204968