Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
2000-01-28
2001-03-20
Arbes, Carl J. (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S740000, C029S832000, C228S009000, 73
Reexamination Certificate
active
06202293
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to a work holder assembly for bonding wire to an electronic component in a package.
2. Description of the Related Art
Electronic components are commonly formed by semiconductor chips having electrical contacts mounted onto a plastic package substrate having conductive elements forming a circuit board. The electrical contacts of the chip must be connected to the conductive elements of the package substrate to complete the circuit. It is common to solder, or wire bond, the electrical contacts with the conductive elements to complete the circuit of the electronic component. Some wire bonding processes require the electronic components to be bonded at high temperatures such as 150 degrees Celsius or higher. The components must also be held rigidly in place during the wire bonding process. One common process includes heating the package substrate in a furnace, or oven, for times ranging from 4 to 15 minutes, then transferring the package substrate to a heated wire bonding fixture for the wire bonding process. However, due to the poor thermal heat characteristics of the package and fixture, the package must often times be reheated in the wire bonding fixture to bring the package up to the specified temperature range for the wire bonding process.
Therefore, it is desirable to provide a work holder which can support the package on a continuously heated wire bonding fixture and transport the heated fixture between a heating position for directing heated gas onto the package and a wire bonding position for bonding the wire to the package.
SUMMARY OF THE INVENTION
Accordingly, the present invention is a work holder assembly for bonding wire to an electronic component in a package. The work holder assembly includes a base extending longitudinally between a first end and a second end. The work holder assembly further includes a fixture for removably securing the package to the base. The work holder assembly includes a linear slide extending between the first end and the second end of the base with the fixture coupled to the linear slide and moveable between a wire bonding position and a heating position. The work holder assembly also includes a gas heater operatively coupled to the base for directing heated gas onto the package in the heating position and a fixture heater operatively coupled to the fixture for heating and maintaining the fixture at a predetermined fixture temperature. The work holder assembly additionally includes a first temperature controller operatively connected to the base for actuating the heater to direct the heated gas onto the package in the heating position and a second temperature controller operatively connected to said base for actuating and heating the fixture to said predetermined fixture temperature for bonding wire to the electronic component in the package in the wire bonding position.
One advantage of the present invention is the work holder assembly positions the package, secured to the fixture, in both the heating position for directly applying heated gas to the package for a predetermined, programmed, period of time and the wire bonding position for bonding wire to the package. Another advantage of the present invention is the work holder assembly continues to heat the fixture to maintain a temperature range in the package during the wire bonding process.
Additionally, room temperature wire bonding processes, such as aluminum wire bonding, may be accomplished with the work holder assembly by simply turning off the heating mechanisms.
Other features and advantages of the present invention will be readily appreciated as the same becomes better understood after reading the subsequent description when considered in connection with the accompanying drawings.
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Quier Glenn Alan
Schaller Alfred
Arbes Carl J.
Kajander John
Trinh Minh
Visteon Global Technologies Inc.
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