Work clamp and wire bonding apparatus

Details Work clamp and wire bonding apparatus Work clamp and wire bonding apparatus

2011-07-12

2011-07-12

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Gaseous flux

C228S044700, C228S904000

Reexamination Certificate

active

07975899

ABSTRACT:
A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing an amount of antioxidant gas that is used are provided. The work clamp includes an interior hollow portion10providing an atmosphere of the antioxidant gas, a lower opening portion11aprovided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portion11provided above the interior hollow portion, for exposing the bonding area, a cavity13covering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports14a,14bprovided at the cavity, for introducing the antioxidant gas into the cavity, and holes21connected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.

REFERENCES:
patent: 4583676 (1986-04-01), Pena et al.
patent: 5162068 (1992-11-01), Yamamoto et al.
patent: 5320273 (1994-06-01), Goenka et al.
patent: 5433371 (1995-07-01), Morisako
patent: 5538176 (1996-07-01), Hasegawa et al.
patent: 5560531 (1996-10-01), Ruszowski
patent: 5785237 (1998-07-01), Lasto et al.
patent: 5862588 (1999-01-01), Heim et al.
patent: 6102273 (2000-08-01), Satoh
patent: 6105847 (2000-08-01), Kim
patent: 6234376 (2001-05-01), Wicen
patent: 6257478 (2001-07-01), Straub
patent: 6499644 (2002-12-01), Cox et al.
patent: 6824037 (2004-11-01), Sakai et al.
patent: 6866182 (2005-03-01), Wong et al.
patent: 7026190 (2006-04-01), Kobayashi et al.
patent: 7093744 (2006-08-01), Seki et al.
patent: 7182793 (2007-02-01), Duan et al.
patent: 2003/0019906 (2003-01-01), Sakai et al.
patent: 2005/0161488 (2005-07-01), Duan et al.
patent: 2007/0251980 (2007-11-01), Gillotti et al.
patent: 2007/0284421 (2007-12-01), Gillotti et al.
patent: 5-109793 (1993-04-01), None
patent: 2003-37131 (2003-02-01), None
International Search Report issued Jul. 17, 2007 in International Application PCT/JP2007/057901.

Affiliated with

Also associated with

Rating

Work clamp and wire bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Work clamp and wire bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Work clamp and wire bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2654280