Work chuck for wire bonder and method

Details Work chuck for wire bonder and method Work chuck for wire bonder and method

1988-03-21

1989-05-02

Jordan, M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228 45, B23K 3100

Patent

active

048260690

ABSTRACT:
An apparatus and method for making high-speed wire bonds between a semiconductor chip and a chip carrier. A chuck supported on a pushrod passing through a rotating sleeve holds the chip and provides Z- and theta- motions, while the bonding head provides X- and Y- movements relative to the chip. Limiting the bonding head to X- and Y- motions significantly reduces the dynamic forces on the bonding head and supporting mechanism, thereby enabling a faster rate of reliable operation. A signal source directly contacts the pushrod to provide reference signals to control circuitry regarding the position of the anvil and chip supported thereon.

REFERENCES:
patent: 3709422 (1973-01-01), Diepeveen
patent: 3894672 (1975-07-01), Arai et al.
patent: 4239144 (1980-12-01), Elles et al.
patent: 4759073 (1988-07-01), Shah et al.

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