Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1976-12-27
1978-04-25
Klein, David
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156335, 264123, 428326, 428529, B29J 500
Patent
active
040861252
ABSTRACT:
A rapidly curable phenol-formaldehyde resin is provided in the form of an emulsion which has particular utility in panel board production, particularly waferboard production.
REFERENCES:
patent: 1976433 (1934-10-01), Cheetham
patent: 2185447 (1940-01-01), Thompson et al.
patent: 2937159 (1960-05-01), McKay et al.
patent: 3267053 (1966-08-01), Nagle et al.
patent: 3422068 (1969-01-01), Kreibich et al.
Chandramouli Pitchaiya
Vasishth Ramesh C.
Cor Tech Research Ltd.
Gallagher J. J.
Klein David
LandOfFree
Wood lamination method utilizing emulsified phenol-formaldehyde does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wood lamination method utilizing emulsified phenol-formaldehyde , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wood lamination method utilizing emulsified phenol-formaldehyde will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2419693