Wood lamination method utilizing emulsified phenol-formaldehyde

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156335, 264123, 428326, 428529, B29J 500

Patent

active

040861252

ABSTRACT:
A rapidly curable phenol-formaldehyde resin is provided in the form of an emulsion which has particular utility in panel board production, particularly waferboard production.

REFERENCES:
patent: 1976433 (1934-10-01), Cheetham
patent: 2185447 (1940-01-01), Thompson et al.
patent: 2937159 (1960-05-01), McKay et al.
patent: 3267053 (1966-08-01), Nagle et al.
patent: 3422068 (1969-01-01), Kreibich et al.

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